Wafer Slicing Machine: S-LM-116G
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Description
Precise slicing machine for fragile materials such as glass, ceramics, ferrite.
Feature 1
16"-size blade for easy handling, lifting and adjustment.
Feature 2
Open-structure loading unit for easy mounting of the workpiece.
Feature 3
Easy setting of slicing speed and wafer thickness with digital switch.
Feature 4
Strong frame, highly rigid table provides long-term stability in performance.
Feature 5
Easy coolant adjustment and dressing operation.
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Wafer Slicing Machine: S-LM-116G