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Wafer Edge Grinding: W-GM-5200 buy in Petaling Jaya
Buy Wafer Edge Grinding: W-GM-5200
Wafer Edge Grinding: W-GM-5200

Wafer Edge Grinding: W-GM-5200

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Malaysia, Petaling Jaya
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+60( 
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Technical characteristics
  • BrandEdge
Description
  • Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
  • The non-contact measuring method achieves the stable alignment.
  • Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
  • The modular concept to make the optimum process line possible.
  • Low damage grinding method is available.
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Wafer Edge Grinding: W-GM-5200
Wafer Edge Grinding: W-GM-5200
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