Wafer Slicing Machine: S-LM-116G

Precise slicing machine for fragile materials such as glass, ceramics, ferrite.

Feature 1

16"-size blade for easy handling, lifting and adjustment.

Feature 2

Open-structure loading unit for easy mounting of the workpiece.

Feature 3

Easy setting of slicing speed and wafer thickness with digital switch.

Feature 4

Strong frame, highly rigid table provides long-term stability in performance.

Feature 5

Easy coolant adjustment and dressing operation.